Cepheus Technology Ltd. is known for manufacturing world-class range of Dicing Saw Chuck Table. Our products are primarily used to support and chuck the semiconductor wafer while dicing and grinding. In addition, the products find huge application in process of dicing, thinning, transportation, cleaning and many more. The dicing saw chuck table is available in customized sizes as per the requirement of clients. Furthermore, our products are quality tested at each level of production and stand tall in term of durability, impact strength and durability. The ranges of chuck tables offered by us are offered t cost-effective with comprising on the parameter of quality.
With the assistance of promising and excellently controlled synthesis process, the poriferous ceramic substrates or panels have uniform distribution of pores as well as uniform size. Completely distributed effect can be achieved by using it in the field of object suction or filtration.
Principle characteristics of Suction Panel:
The size of the pore can be controlled in the array from sub micrometer to several tenth micrometers.
30% to 80% ventilation rate can be controlled.
Have inflexible and sturdy mechanical properties that help in sustaining breakdown stress up to 900 - 1000 kg/cm2.
The surface of the panel have flatness of 5um/100mm.
The roughness of the panel's surface is 2 um or better.
- Automatic load-unload
- Chuck table for IC and LED wafer ,glass dicing ,etc
- Fixed position
- High precision screen printing
- High precision stacking
- Object suction
Either in the application field of filtration or object suction, any size and shape of the panels are accessible. A chuck table for wafer dicing, the dimension of the panel diameter could be 12 ,8,6,5,4,3 and other dimensions are acquirable. Figure 2 is a square type of chuck table utilized for screen printing or slurry filtration, LED wafer, we can supply the dimension(C) of the panel side by dimensions below 300 mm.